应用

　　This Equipment is fully automatic application of remove the protection tape on the surface of the semiconductor wafer after back grinding.

　　技术

　　• 应用8-12 inch，thickness ≥150 um 8”; ≥250 um 12”

　　• UPH 45~50 unit/hour

　　• Application Tape：Normal / UV Tape

　　• UV Wavelength: 365 nm; Type: LED

　　• 支持SECS/GEM