应用

　　This Equipment is specially designed to attach dicing tape on the back side of wafer and ring frame automatically, which contributes to improve quality and productivity in wafer dicing and die mount process.

　　技术

　　• 应用8-12 inch，thickness >200 um

　　• Application Wafer Type：Silicon & Bump Wafer

　　• UPH 60 unit/hour

　　• Application Tape：Normal / UV Tape/ Precut Tape

　　• 支持SECS/GEM